Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 13, 2009
0Patent Application Number
116032390
Date Filed
November 22, 2006
0Patent Primary Examiner
Patent abstract
A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L2≦(L1/3) is set, where L1 denotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer and L2 denotes the shortest separation distance between the pair of the via forming parts.
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