US Patent 7476978 Electronic component having a semiconductor power device

An electronic component adapted to be mounted on a substrate with landing pads having a landing pad layout has a power semiconductor device and outer contact surfaces with a component pad layout. The outer contact surfaces have an arrangement so that, in a first orientation, the component pad layout matches the landing pad layout and in a rotational reorientation of the entire electronic component about the component axis by an angle other than 360°, the outer contact surfaces are translated to each other so that the component pad layout matches the landing pad layout.