Patent attributes
Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-end module coupled to the first surface of the substrate, and a ground plane layer positioned on the second surface of the substrate. The electronic assembly also includes an insulating layer on the ground plane layer, with the ground plane layer positioned between the second surface and the insulating layer. In addition, the electronic assembly also includes an antenna layer on the insulating layer, with the insulating layer positioned between the antenna layer and the ground plane layer.
