Patent attributes
A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist film formed on the first surface to cover the wires, and openings formed by partially opening the solder resist film, wherein a plurality of the elongated wires are arranged in parallel on the bottom of the openings, a semiconductor chip having electrodes flip chip connected to the wires are arranged on the bottom of the openings of the wiring board through a conductive bonding material, and an insulating resin is provided for filling an interstice between the wiring board and the semiconductor chip, wherein the wires extend along a width direction orthogonal to a longitudinal direction of the openings, the openings comprise elongated grooves which extend along at least two opposing sides of the square of the wiring board, a pair of opposing edges of the opening along the longitudinal direction define zig-zag edges in which the widths of the opening seem to be longer and shorter in a repeating sequence, and recessed edge portions which recess toward the outside of the opening formed by the zig-zag edges in the width direction correspond to the wires, and protruded edge portions which protrude toward the inside of the opening formed by the zig-zag edges in the width direction correspond to the board core between adjoining the wires.
