Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Voya Markovich0
Corey Seastrand0
David L. Thomas0
John M. Lauffer0
Date of Patent
January 20, 2009
Patent Application Number
11429990
Date Filed
May 9, 2006
Patent Primary Examiner
Patent abstract
A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
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