Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 20, 2009
Patent Application Number
11558413
Date Filed
November 9, 2006
Patent Primary Examiner
Patent abstract
An integrated circuit package system is provided including forming a paddle, forming a ring with a recess in the paddle, mounting a device in the recess, forming a slot in the ring, and mounting a heat sink in the slot over the device.
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