Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshitaka Aoki0
Hironao Fujiki0
Kazuhiko Tomaru0
Kunihiko Mita0
Date of Patent
February 3, 2009
Patent Application Number
11527641
Date Filed
September 27, 2006
Patent Primary Examiner
Patent abstract
A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
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