US Patent 7485003 Electromagnetic interference cable backshell assembly for high-density interconnect

Patent 7485003 was granted and assigned to Silicon Graphics on February, 2009 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Silicon Graphics

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

74850030

Patent Inventor Names

Val Mandrusov0

Duane Friesen0

Date of Patent

February 3, 2009

Patent Application Number

102352210

Date Filed

September 5, 2002

Patent Primary Examiner

‌

Hae Moon Hyeon

Patent abstract

A cable connector assembly for high frequency applications having reduced electromagnetic emissions. Aspects include providing physical spacing and electrical isolation between the signal conductors and a conductive housing. An isolative member provides reduced capacitive coupling. One embodiment includes spring preloading of the electrical connector relative to the housing. One embodiment includes a connector floating longitudinally within a conductive housing.

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