Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 3, 2009
Patent Application Number
11012196
Date Filed
December 16, 2004
Patent Primary Examiner
Patent abstract
A circuit with embedding components (13) is produced by placing the components (13) on a substrate (14) and applying sheets (15) of prepreg. The prepreg sheets (15) have apertures to accommodate the -components, the number of sheets and arrangement of apertures being chosen to accommodate a variety of component X, Y and Z dimensions. A top layer with Cu foil (16(b)) is applied. The assembly is pressed in an operation analogous to conventional multilayer board lamination pressing. This causes all of the prepreg resin to flow to completely embed the components without raids or damage. Electrical connections are made by drilling and plating vias.
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