Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 3, 2009
Patent Application Number
11399358
Date Filed
April 7, 2006
Patent Primary Examiner
Patent abstract
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
