Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tongbi Jiang0
Frank L. Hall0
Jason L. Fuller0
Date of Patent
February 3, 2009
0Patent Application Number
112168140
Date Filed
August 31, 2005
0Patent Primary Examiner
Patent abstract
An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.
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