US Patent 7485972 Semiconductor device
Patent 7485972 was granted and assigned to Panasonic on February, 2009 by the United States Patent and Trademark Office.
All edits
Edits on 15 Sep, 2023
Golden AI
Edits made to:
Article (+388 characters)
Article
Patent abstract
Provided is a semiconductor device which includes a conductive bonding pad formed on a semiconductor substrate of the first conduction type via an insulating film and a diffusion layer of the second conduction type formed on a surface of the semiconductor substrate under the bonding pad. Characteristics do not deteriorate even when a breakdown occurs during wire bonding.
Edits on 26 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07485972 Semiconductor device US Patent 7485972 Semiconductor device
Infobox
Patent Number
0748597200
Patent Number
748597200
Edits on 22 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074859720
Date of Patent
February 3, 2009
0Patent Application Number
113561440
Date Filed
February 17, 2006
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074859720
Date of Patent
February 3, 2009
0Patent Application Number
113561440
Date Filed
February 17, 2006
0Official Website
Patent Primary Examiner
Edits on 14 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 1 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07485972 Semiconductor device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07485972
Date of patent
February 3, 2009
Patent application number
11356144
Date Filed
February 17, 2006
Patent primary examiner
Find more entities like US Patent 7485972 Semiconductor device
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
