Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hidekiyo Takaoka0
Kiyotaka Maegawa0
Date of Patent
February 10, 2009
0Patent Application Number
119798120
Date Filed
November 8, 2007
0Patent Primary Examiner
Patent abstract
A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.
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