Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasuyuki Ogawa0
Yutaka Takafuji0
Takashi Itoga0
Date of Patent
February 10, 2009
0Patent Application Number
109407350
Date Filed
September 15, 2004
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A relaying pad is formed in a predetermined portion in an insulation layer of the single-crystal thin film device, in a region where the single-crystal thin film device is formed. The relaying pad is for providing connection wiring through the insulator substrate. With this configuration it is possible to prevent an increase in an aspect ratio of a contact hole formed in an insulation layer in a region in which a transferred device is formed, the semiconductor device including a substrate on which the transferred device and a deposited device coexist.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.