Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 10, 2009
Patent Application Number
11096542
Date Filed
April 1, 2005
Patent Primary Examiner
Patent abstract
A semiconductor package is disclosed for an integrated circuit die (52). The integrated circuit die is electrically connected to the package substrate by either die solder balls (53a), or wirebonds (53b). The package substrate (50), a single sided printed wiring board, has a thick metal core (100), consisting of a base metal, a core capacitor, and one or more thin build up layers.
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