Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seiichi Matsushima0
Hiroki Maruyama0
Kenji Murakami0
Date of Patent
February 17, 2009
Patent Application Number
11131235
Date Filed
May 18, 2005
Patent Primary Examiner
Patent abstract
There is provided a method of manufacturing an electro-optical device from a large substrate that is cut into a plurality of first substrates having a chip shape. In the electro-optical device, second substrates of a chip shape are bonded to the first substrates. The method includes adhering a large glass substrate to approximately an entire surface of the large substrate opposite to a surface to which the second substrates are bonded; and cutting both the large substrate and the large glass substrate into first substrate units.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
