US Patent 7491895 Wiring substrate and method of fabricating the same
Patent 7491895 was granted and assigned to Sanyo on February, 2009 by the United States Patent and Trademark Office.
All edits
Edits on 15 Sep, 2023
Golden AI
Edits made to:
Article (+568 characters)
Article
Patent abstract
A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring substrate includes a via formed to fill a recess provided in the insulating resin film and electrically connecting the top side and back side of the insulating resin film. The via includes a first metal film formed to cover the side wall of the recess, an oxide film formed to cover the first meal film, and a second metal film formed on the metal oxide film.
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07491895 Wiring substrate and method of fabricating the same US Patent 7491895 Wiring substrate and method of fabricating the same
Infobox
Patent Number
0749189500
Patent Number
749189500
Edits on 25 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074918950
Date of Patent
February 17, 2009
0Patent Application Number
111403040
Date Filed
May 26, 2005
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074918950
Date of Patent
February 17, 2009
0Patent Application Number
111403040
Date Filed
May 26, 2005
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 1 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07491895 Wiring substrate and method of fabricating the same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07491895
Date of patent
February 17, 2009
Patent application number
11140304
Date Filed
May 26, 2005
Patent primary examiner
Find more entities like US Patent 7491895 Wiring substrate and method of fabricating the same
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
