Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Noriko Tanaka0
Keiji Ishibashi0
Date of Patent
February 24, 2009
0Patent Application Number
117063310
Date Filed
February 15, 2007
0Patent Primary Examiner
Patent abstract
A method of measuring warpage of a rear surface of a substrate includes a substrate detection step, a best fit plane calculation step, and a warpage calculation step. Further, the method of measuring warpage of a rear surface of a substrate can further includes after the substrate detection step and before the best fit plane calculation step: a noise removal step and an outer peripheral portion removal step; the outer peripheral portion removal step and a smoothing step; or the noise removal step, the outer peripheral portion removal step, and the smoothing step. Thereby, a method of measuring warpage of a rear surface with a high surface roughness of a substrate can be provided.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
