US Patent 7495266 Strained silicon-on-silicon by wafer bonding and layer transfer
Patent 7495266 was granted and assigned to Massachusetts Institute of Technology on February, 2009 by the United States Patent and Trademark Office.
Currently, there are no issues on this topic.
Find more entities like US Patent 7495266 Strained silicon-on-silicon by wafer bonding and layer transfer
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
