Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mou-Shiung Lin0
Shih-Hsiung Lin0
Hsin-Jung Lo0
Date of Patent
February 24, 2009
0Patent Application Number
114223370
Date Filed
June 6, 2006
0Patent Primary Examiner
Patent abstract
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.
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