Patent attributes
A semiconductor memory card includes a nonvolatile memory chip mounted on an upper surface of a circuit board. The memory chip has first bonding pads formed close to a first side of the memory chip that are wire-bonded to first board terminals formed on the board along the first side. A controller chip mounted on the memory chip has second bonding pads wire-bonded to second board terminals formed on the board along a second side of the memory chip, adjacent to the first side. A power terminal or a ground terminal has a connection and an extension extended from the connection. The connection and the extension are along the first board terminals and the second board terminals. The connection and the extension are on a lower surface of the board and connect to the first board terminals or the second board terminals via through hole interconnections and the board wiring.
