Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kinya Ichikawa0
Date of Patent
February 24, 2009
0Patent Application Number
111736570
Date Filed
June 30, 2005
0Patent Primary Examiner
Patent abstract
In one embodiment, a stack is assembled comprising a first integrated circuit package, and a substrate connector which connects the integrated circuit package to a circuit board. In one embodiment, the substrate connector includes an interposer substrate and a patch substrate bonded to the interposer substrate. Each substrate includes columnar conductors extending through the substrate to connect to another layer. Other embodiments are described and claimed.
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