US Patent 7495497 Temperature compensated integrated circuits
Patent 7495497 was granted and assigned to Transmeta on February, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Robert Fu0
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Patent abstract
A method and system of temperature compensated integrated circuits. Operating characteristics of integrated circuitry are enhanced by application of temperature compensation.
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US Patent 07495497 Temperature compensated integrated circuits US Patent 7495497 Temperature compensated integrated circuits
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Patent Number
074954970
Patent Number
74954970
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Patent Jurisdiction
Patent Number
074954970
Date of Patent
February 24, 2009
0Patent Application Number
111255550
Date Filed
May 9, 2005
0Official Website
Patent Primary Examiner
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US Patent 07495497 Temperature compensated integrated circuits
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07495497
Date of patent
February 24, 2009
Patent application number
11125555
Date Filed
May 9, 2005
Patent primary examiner
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