Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sam Shiao0
Steven M. Shimotani0
Date of Patent
February 24, 2009
0Patent Application Number
117653680
Date Filed
June 19, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.
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