Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazuhisa Arai0
Date of Patent
March 3, 2009
0Patent Application Number
110927560
Date Filed
March 30, 2005
0Patent Primary Examiner
Patent abstract
A wafer processing method is capable of easily handling even a thinly formed wafer during the processing thereof. An annular protective member is bonded to an outer circumferential excess region on an outer surface of the wafer, on which devices are not formed, and a rear surface is ground with the outer surface left in the mentioned condition. Since the outer circumference of the wafer is reinforced with the annular protective member, the handling of the wafer becomes easy even after the wafer becomes thinner due to a grinding operation.
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