Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pyoung-Wan Kim0
Jung-Seok Ryu0
Date of Patent
March 3, 2009
Patent Application Number
11354469
Date Filed
February 14, 2006
Patent Primary Examiner
Patent abstract
A package substrate may have an improved surface structure for controlling the flow of an adhesive. The package substrate may have an upper surface and a lower surface covered with a passivation layer. A window may be provided in, for example, the center of the package substrate. Sinks may be provided on the lower surface, clear of the passivation layer. The semiconductor package may have an indented or non-planar surface structure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
