Patent attributes
Electrical coupling apparatus providing transition between a high radio frequency waveguide and a perpendicularly oriented microstrip line without use of a shorting cap fixes an open end of the waveguide perpendicularly to a dielectric substrate. The microstrip line is carried on the substrate and couples through a hole in the waveguide wall to a microstrip patch on the substrate within the waveguide having a resonance with the waveguide encompassing a predetermined high radio frequency bandwidth of signals to be conducted by the apparatus. A plurality of parallel conducting members form a via fence aligned with the waveguide wall and extending through the substrate to electrically connect the waveguide to a planar ground conductor that covers the opposite side of the substrate, including the area under the open end of the waveguide.
