Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 10, 2009
Patent Application Number
11591716
Date Filed
November 2, 2006
Patent Primary Examiner
Patent abstract
A directly cooled diode-laser bar package includes a diode-laser bar bonded to a heat-sink. The operating temperature of the diode-laser bar can be selectively varied by varying the thermal impedance of the heat-sink in or near a region of the heat-sink on which the diode-laser bar is bonded. The thermal impedance is selectively varied by varying the insertion depth of screws inserted into corresponding screw holes extending into the heat-sink close to or immediately adjacent the region on which the diode-laser bar is bonded.
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