Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Gisbert Gerhard Thomke0
Anand Haridass0
Dierk Kaller0
Erich Klink0
Date of Patent
March 17, 2009
Patent Application Number
11095741
Date Filed
March 31, 2005
Patent Primary Examiner
Patent abstract
A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball grid array (BGA) makes contact only on the surface pads of the printed circuit board with no plated through holes/vias underneath these surface pads. This opens up wiring channels, which previously used to be occupied by plated through holes and anti-pads, that can now be used for maximizing signal line wiring routing.
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