US Patent 7505109 Heat dissipation structure of backlight module
Patent 7505109 was granted and assigned to AU Optronics on March, 2009 by the United States Patent and Trademark Office.
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The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode (LED) chip, wherein the circuit board has an electric circuit layer and a heat conductive layer respectively formed on two opposite surfaces thereof. The circuit board has a plurality of through holes penetrating through the electric circuit layer and the heat-conductive layer of the circuit board, wherein each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes, and the LED chip is disposed on the heat-conductive element and is electrically connected to the electric circuit layer.
US Patent 07505109 Heat dissipation structure of backlight module US Patent 7505109 Heat dissipation structure of backlight module
US Patent 07505109 Heat dissipation structure of backlight module
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