US Patent 7506434 Electronic parts mounting method

An electronic parts mounting apparatus and an electronic parts mounting method for picking up a plurality of electronic parts simultaneously by a transfer head having a plurality of suction nozzles from a plurality of tape feeders and then mounting the electronic parts on a substrate are provided. Displacement amounts of parts stop positions in respective tape feeders are detected in advance and stored as stop position correction data, and then tape feeding mechanisms are controlled based on the stop position correction data upon picking up the parts by the transfer head to execute such a registration that causes the parts stop positions to coincide with parts suction positions of the suction nozzles in the transfer head.