Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 24, 2009
Patent Application Number
12166505
Date Filed
July 2, 2008
Patent Primary Examiner
Patent abstract
A method in forming high-temperature alloy solder standoff in a solder bumping process, such as in injection molded solder molds. The standoffs are formed in an injection molded solder mold, by means of pre-depositing a layer of a metal at select sites, such as some of the cavities which are formed in the surface of the mold, and thereafter, filling the mold cavities with solder, utilizing standard techniques as known in the technology. The particular metal, which is deposited in at least some of the mold cavities, will alloy with the solder during or after transfer, and will result in the formation of a higher temperature alloy solder at select locations in the mold cavities.
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