Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ryosuke Usui0
Yasunori Inoue0
Hideki Mizuhara0
Date of Patent
March 24, 2009
0Patent Application Number
110866350
Date Filed
March 22, 2005
0Patent Primary Examiner
Patent abstract
A via hole is formed by a first step of forming an opening in a resin insulating film by laser radiation, a second step of forming an opening in said resin insulating film by dry etching and a third step of performing reverse sputtering in a plasma environment.
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