US Patent 7508064 Package for sealing an integrated circuit die
Patent 7508064 was granted and assigned to Analog Devices on March, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Carl M. Roberts, Jr.0
John R. Martin0
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Patent abstract
A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.
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US Patent 07508064 Package for sealing an integrated circuit die US Patent 7508064 Package for sealing an integrated circuit die
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Patent Number
07508064
Patent Number
7508064
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Official Website
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US Patent 07508064 Package for sealing an integrated circuit die
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Is a
Current assignee
Patent jurisdiction
Patent number
07508064
Date of patent
March 24, 2009
Patent application number
11169276
Date Filed
June 28, 2005
Patent primary examiner
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