Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshihiro Ogawa0
Seishi Watanabe0
Date of Patent
March 24, 2009
Patent Application Number
11275352
Date Filed
December 28, 2005
Patent Primary Examiner
Patent abstract
In a surface mount LED, circuit patterns can be formed on selective portions of the bottom and inner circumferential surfaces of a recess in a substrate in which an LED chip is mounted. A sealant material composed of a light transmissive resin can be applied to cover the LED chip for sealing. An intimate contact interface is formed between the material of the insulator/substrate which is exposed at a portion with no circuit pattern formed thereon, and the light transmissive resin. The strength of intimate contact can be enhanced to prevent the circuit patterns and conductive adhesive from peeling off at an interface therebetween.
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