Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 24, 2009
Patent Application Number
10592179
Date Filed
March 28, 2005
Patent Primary Examiner
Patent abstract
A mid-infrared emitter sub-system includes a heat sink and a diamond thermal diffusion layer connected to the heat sink through a first thermal bonding layer. The first thermal bonding layer has a first melting point. A semiconductor slab portion of a semiconductor laser is connected to the diamond thermal diffusion layer through a second thermal bonding layer. The second thermal bonding layer has a second melting point that is less than the first melting point.
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