US Patent 7509594 Method of selling integrated circuit dies for multi-chip packages

An integrated circuit has a plurality of bonding pads, at least one of which is adapted to be directly electrically connected to a bonding pad of another integrated circuit rather than to an external pin of a package that houses a semiconductor die on which the integrated circuit is fabricated. The integrated circuit is designed and offered for sale. Preferred scenarios include offering the integrated circuit for sale even before receiving an order for the semiconductor die or alternatively, only in response to receiving a first such order. Preferably the die is offered for sale as a standard item. The dies are either fabricated on demand or kept in inventory.