Patent attributes
The disclosed technique employs a process for mating polarizing wafers to clear lenses using a high-yield bonding process. A thermoformed polarizing wafer is bonded to a clear lens of similar curvature via a solvent bonding process. In one embodiment, a system includes a translation stage configured to press a first lens to a second, with a solvent therebetween, such that a portion of the first lens initially contacts a portion of the second lens. An alignment fixture holding the second lens conforms to the curvature of the second lens, and a deformable sheet mounted proximate to the alignment fixture flexes in response to the force so that either of the first or second lenses conforms to a curvature of the other, and so that the pressure of the first lens against the second lens presses the solvent radially outward to the perimeter of the second lens to bond the first lens to the second lens.