US Patent 7511371 Multiple die integrated circuit package
Patent 7511371 was granted and assigned to SanDisk on March, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 1, 2005
Date of Patent
March 31, 2009
Patent Application Number
11264112
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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