Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 31, 2009
Patent Application Number
11420390
Date Filed
May 25, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor chip having a plurality of device formative layers that are formed into an integrated thin film is provided by a technique for transferring. According to the present invention, a semiconductor chip that is formed into a thin film and that is highly integrated can be manufactured by transferring a device formative layer with a thickness of at most 50 μm which is separated from a substrate into another substrate by a technique for transferring, and transferring another device formative layer with a thickness of at most 50 μm which is separated from another substrate to the above device formative layer, and, repeating such transferring process.
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