US Patent 7512514 Accurate on-die temperature measurement using remote sensing
Patent 7512514 was granted and assigned to Intel on March, 2009 by the United States Patent and Trademark Office.
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Patent abstract
An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.
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US Patent 07512514 Accurate on-die temperature measurement using remote sensing US Patent 7512514 Accurate on-die temperature measurement using remote sensing
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Patent Number
0751251400
Patent Number
751251400
Edits on 22 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075125140
Date of Patent
March 31, 2009
0Patent Application Number
115400020
Date Filed
September 29, 2006
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075125140
Date of Patent
March 31, 2009
0Patent Application Number
115400020
Date Filed
September 29, 2006
0Official Website
Patent Primary Examiner
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US Patent 07512514 Accurate on-die temperature measurement using remote sensing
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07512514
Date of patent
March 31, 2009
Patent application number
11540002
Date Filed
September 29, 2006
Patent primary examiner
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