Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 7, 2009
Patent Application Number
11588647
Date Filed
October 27, 2006
Patent Primary Examiner
Patent abstract
A method of manufacturing a semiconductor device includes providing a base plate; mounting a plurality of semiconductor chips, the plural semiconductor chips being mounted apart from each other; forming an insulating film on an upper surface of the base; forming a plurality of pairs of re-wirings on the insulating film, each of the re-wirings being connected to a connection pad of any of the semiconductor chips the insulating film formed on the periphery of the semiconductor chip, and the re-wiring having a pad portion arranged in the region of the insulating film.
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