US Patent 7514769 Micro surface mount die package and method
Patent 7514769 was granted and assigned to National Semiconductor on April, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 13, 2005
0
Date of Patent
April 7, 2009
0
Patent Application Number
11202797
0
Patent Inventor Names
Shahram Mostafazadeh
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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