Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yusuke Kawaguchi0
Tomohiro Kawano0
Yasuhito Saito0
Yoshiki Endo0
Akio Nakagawa0
Haruki Arai0
Hiroshi Takei0
Ichiro Omura0
...
Date of Patent
April 7, 2009
0Patent Application Number
112147300
Date Filed
August 31, 2005
0Patent Primary Examiner
Patent abstract
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
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