Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 7, 2009
Patent Application Number
11373339
Date Filed
March 13, 2006
Patent Primary Examiner
Patent abstract
A method and system for testing a wafer comprising semiconductor chips are disclosed. A determination of whether or not the wafer is defective is made in relation to a spatially related group of filtered failed semiconductor chips on the wafer, where the spatially related group corresponds to a localized failure on the wafer and is used to calculate a defect index value.
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