Patent attributes
A mounting board has a thickness L2 being thicker than a thickness L1 of a solid state imaging device. In the mounting board, an attachment opening for containing the solid state imaging device is formed. In addition, a side surface of the solid state imaging device is a tapered surface having an inclination angle θ1, and an internal surface of the attachment opening is a tapered surface having an inclination angle θ2 larger than the inclination angle θ1. On the side surface of the solid state imaging device and the internal surface of the attachment opening respectively, contact terminals are provided for electrically connecting the solid state imaging device and the mounting board, when the contact terminals contact each other according to insertion of the solid state imaging device into the attachment opening.
