Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yi-Qiang Wu0
Chun-Chi Chen0
Gen-Ping Deng0
Date of Patent
April 7, 2009
0Patent Application Number
117579170
Date Filed
June 4, 2007
0Patent Primary Examiner
Patent abstract
A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.
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