US Patent 7515434 Technique for enhancing circuit density and performance

A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and performance of a microelectronic module. The method may comprise forming a discrete package, wherein the discrete package comprises one or more passive devices that are desirable for the performance of the microelectronic module. The method may also comprise coupling the discrete package to the microelectronic module.