Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Koji Temba0
Date of Patent
April 14, 2009
0Patent Application Number
112543120
Date Filed
October 19, 2005
0Patent Primary Examiner
Patent abstract
A wiring board is manufactured by a step of forming a meshy cylindrical body, where plural conductive rings are connected to each other at plural positions in the respective peripheral direction, a step of forming laminated meshy sheets, by squashing the meshy cylindrical body in the radial direction, a step of inserting an insulation sheet between the meshy sheets, and a step of forming lacking portions at a position in the peripheral direction of conductive rings of the meshy sheets. It becomes possible to directly join a semiconductor chip to the conductive ring of the meshy sheet, and therefore, a wiring circuit can be obtained without using a solder joint.
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