Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rachel Layda Abinan0
Allan P. Ilagan0
Dario S. Filoteo, Jr.0
Philip Lyndon Cablao0
Date of Patent
April 14, 2009
0Patent Application Number
116716840
Date Filed
February 6, 2007
0Patent Primary Examiner
Patent abstract
An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
